M2M MULTIX++臺式超聲波相控陣探傷儀
M2M MULTIX++臺式超聲波相控陣探傷儀
產(chǎn)品線
MULTIX ++完全并行架構(gòu)提供無與倫比的性能。 MULTIX ++系統(tǒng)是優(yōu)化檢測速度的理想選擇，可以并行驅(qū)動多達256個通道。 可直接使用其專用軟件或通過第三方應(yīng)用程序遠程使用。 可以使用設(shè)置軟件處理復(fù)雜的配置。
處理技術(shù)
標(biāo)準(zhǔn)相控陣
MultiX ++系統(tǒng)可以執(zhí)行電子和/或扇形掃查，全矩陣捕獲（FMC），脈沖回波，采用標(biāo)準(zhǔn)UT，TOFD，線性，矩陣，TRL，個性化2D ...相控陣探頭進行間距捕獲采集，最多可包含256個晶片
表面自適應(yīng)超聲波 (SAUL)
表面自適應(yīng)超聲波 (SAUL) 技術(shù)專為復(fù)雜復(fù)合材料結(jié)構(gòu)的檢測而設(shè)計，可使用獨特的配置檢測具有不同幾何形狀（平面，凹面，凸面）的元件。 SAUL是飛機制造商及其供應(yīng)商使用的理想工具，用于檢測復(fù)雜的復(fù)合材料部件。
SAMRT
智能柔性探頭是由CEA和IMASONIC共同設(shè)計的相控陣探頭（線性或矩陣），具有適形的前面和實時輪廓。 SMART是M2M處理這些探頭的軟件插件。當(dāng)探頭沿著復(fù)雜的部件移動時，SMART能夠?qū)崟r保持超聲波束的特性。
快速模式
快速模式本身包含在MultiX ++系統(tǒng)中，可優(yōu)化多個孔徑的并行點火（在相同或不同的探頭上）。 它旨在提高生產(chǎn)率，同時保持與電子掃查所達到的相同分辨率。
此外，當(dāng)接收陣列的整個光圈與電子掃描相結(jié)合時，快速模式甚至可以實現(xiàn)更快的速度。 此過程僅需單詞發(fā)射的時間。 非常適合檢測厚元件又要求速度的情況。
此外，當(dāng)接收陣列的整個光圈與電子掃描相結(jié)合時，快速模式甚至可以實現(xiàn)更快的速度。 此過程僅需單詞發(fā)射的時間。 非常適合檢測厚元件又要求速度的情況。
SPECIFICATIONS
| acquisition | |
| Hardware acquisition gates, software gates, synchronization of gates Acquisition trigger on event (threshold, echo, etc.), acquisition on user-specified trigger (e.g., time, coder) | Choice of data (e.g., RF, peaks, elementary A-Scan), real-time imaging, user-specified configuration Public file format for parameters (XML) and data (binary), max. data flow 30 MB/s |
| phased-array | |
| Customized focusing, electronic scanning, sectorial scanning, full matrix capture (FMC) Pulse-echo and transmit-receive modes, DDF with dynamic aperture | 2GB hardware RAM (enabling fast multiplexing), Corrected images (e.g., sectorial B-Scan, C-Scan) |
| pulsers | |
| Adjustable voltage: 30 to 200V with 1V step Negative rectangular pulse Adjustable width: 30 ns to 625 ns, step of 2.5 ns | Rise time < 10 ns (200V, 50 ?) Max. PRF: 30 KHz |
| receivers | |
| Bandwidth: 0.8 to 20MHz Adjustable gain on each channel from 0 to 80 dB Cross-talk between two channels > 50 dB | Max. input signal amplitude: 0.8 Vpp Adjustable analog DAC on 80 dB (max. 40 dB/µs) synchronized on events |
| digitizer | |
| Digitizing and real-time summation on 32-channel boards Max. sampling frequency: 100 MHz (adjustable from 100 MHz to 6.6 MHz) Global delay: 0 up to 1.6 ms, step of 10 ns Delay-laws at transmission/reception: 0 to 20 µs, step of 2.5 ns | Range: 16 bits FIR filters Input impedance: 50 ? Digitizing depth: up to 50,000 samples (16,000 samples max. per elementary channel) |
| hardware / firmware configuration | |
| Parallel summations for fast data acquisition / beam forming Parallel architecture: 32-, 64-, 128-, and 256-channel systems are available | FPGA on CPU-board Windows-based PC, USB2 link between Hardware and PC (desktop or laptop) |
| software | |
| CIVA subset into Multi2000 software, complete description of the inspection configuration | Focal-laws and associated ultrasonic field computation |
| Compatibility with CIVA, NDT kit / ULTIS | |
| I-O | |
| 32: 1 Hypertronix connector 64,128: 2 Hypertronix connectors 256: 4 Hypertronix | |
| 8 encoders input, 31 analog input + 1 synchro output 2 switch, 4 TTL inputs, 4 TTL outputs | 8 analog outputs, 2 open collector, 1 I/O synchro,1 USB2 16 analog inputs, 4 LEMO connectors (type 00) (up to 8 optional) |
| General | |
| 32, 64, 128: L x W x H: 236 mm x 376 mm x 266 mm Weight: ~9.5 kg | 256: L x W x H: 342 mm x 376 mm x 266 mm Weight: ~13 kg |
Indicated values may change without notice.